● High-end Packaging based on Wafer Lvel Platform
| WLP | Flip-chip Bumping
| Tab & Probing Test |
Fan-in WLP
(WLP) | Au bump | TAB |
| | Cu pillar/Solder/
CuNiAu bump | Probing Test |
| | | T&R/P&P |
● What are the applications
WLP
(w/ RDL)
| Cu pillar/Solder/
CuNiAu bump
| Au bumping |
PMIC,Audio
Codec,
Flash MCU | PMIC, Audio Amp,
GPU,AP,CIS | Display Drive IC,
Fingerprint Sensor |
● Service Flow
