● Technologies summary
| Process | Cu Pillar bump | Solder Bump | WLCSP | WLBGA | Au Bump
| Fan-out WLP |
| Products |  |  |  |  |  |  |
Wafer Size
| 8” & 12” | 8” | 12” Panel |
Bump Pitch
(um) | 80~100 (Typ)
30(inner pad)
50(outer pad) | 100~250 (Typ)
40~60 (Micro)
~ 40 (Devep) | < 400 | ≥ 400 | 20um (Min) | > 400um |
Line & Space : 15/15 um
(Qualified internal: 10/10 um) | Line & Space :
25/25 um
(Dev. 15/15 um) |
Bump Material
& composition | Pure Cu
with Solder cap
(Lead free) | Lead free (Sn1.8±0.5Ag)
Eutectic (Sn/37Pb:12” only) | SACxxx,
LFxx | Au | SACxxx |
| Passivation | PI / PBO / Low temp passivation material | NA | Epoxy |
Seed
| Ti/Cu(STD), TiW/Cu | TiW/Au | TiW/Cu |
UBM(Plated)
| NA | Ni only or CuNi(WLCSP), Cu only(WLBGA) | NA | Ni only, non-UBM |
RDL
| Cu only, CuNiAu(RDL finish product) | Cu only |
Qualification
| Under Mass production | Qualified |
● Technology Roadmap
● Reliability Testing Capability
| Category | Equipment | Maker / Model |
Wafer Level /
PKG Level Reliability | TC Chamber | ESPEC /TSA-203ES-W |
| PCT Chamber | ESPEC / EHS-221M |
| HTST Chamber | ESPEC/ IPH-202 |
| Reflow | SEMI gear / GENEVA STP300 |
Test item
| Condition
| Sample Quantity
| Comment |
Precondition
(MSL1) | Bake | 125℃,24hours | 45ea | For Solder Bump |
Moisture Soak | 85℃/85% 168hours |
Reflow | 260℃,3回 |
HIGH TEMPERATURE STORAGE
(HTS) | -55℃? 125℃,各10min
500 Cycle | 45ea | |
TEMPERATURE CYCLE
(TC) | 121℃/100%RH
/2.0 atm168hours | 45ea | |
PRESSURE COOKER TEST
(PCT) | 150℃, 1000Hr | 45ea | |
● Analysis Capability
| Category | Equipment
| Utilization |
| Visual Inspection | Measuring Scope | PKG Dimension |
High & Low Power Microscope | 500x Magnification Visual Analysis |
Contact Profile | Bump height |
Sample
Preprocessing | Cross Sectioning Station | Destructive Package Cross Sectioning |
Decap solution | Internal Visual Inspection of Package |
Hot plate | Heating of sample or liquid |
| Chemical Analysis | ICP | Ag Chemical Analysis |
CVS | Cu Chemical Analysis |
Non-Destructive
Inspection | X-ray Scanner | Non-destructive Internal Characterization
Lead Configuration/Epoxy Void |
| Precise Analysis | SEM + EDX | 3-D analysis + Component analysis |
XRF (X-Ray Fluorescence spectrometer) | elemental analysis and chemical analysis |
| Physical Test | Dage4000 | Shear and Pull strength |
HV Tester | Bump Hardness analysis |