Overview

Jiangsu nepes shall provide "Advanced and Leading Wafer-level Packaging Services and Solutions for China Semiconductor Industry."

Company Name : Jiangsu nepes Semiconductor Co., Ltd.

Meaning of Company : “Eternal Life”

CEO : Yuan Quan

Establishment : 2014.06

Area :  It covers an area of 102,000 square meters with a total building area of 49,628 square meters in phase I and phase II.

Company Profile

　　Jiangsu nepes Semiconductor Co., Ltd. (hereinafter referred to as“JS nepes") is committed to providing advanced and leading wafer-level packaging and testing services and solutions. Our company was established in June 2014 and is a domestic leading high-tech wafer bump packaging and testing enterprise jointly funded by Nepes corporation (a South Korean listed company, stock symbol 033640) and Huai'an stated-owned enterprises Xingsheng and Zhongsheng company. The company has a registered capital of US$95.99 million and is located at No.18 west development avenue, Huai'an industrial park, Huai'an city, Jiangsu province, China.
        The main business of JS nepes includes 8-inch and 12-inch Drive Display IC turnkey (8"&12”Au Bump and PKG (COG & COF), Testing (CP & FT) Service), 8-inch and 12-inch CPB，solder，WLP bump wafer-level packaging turnkey (8”&12”CPB,Solder,WLP Bump, Testing and CSP Service). The technical support from the South Korea Nepes Corporation ensures that our company has always been in an advantageous position in the R&D of advanced processes.
        JS nepes will provide all-round high-quality services for customers at home and abroad with superior and reliable quality, competitive cost, fast production cycle and customer-oriented service!