江苏纳沛斯半导体有限公司

　　Jiangsu nepes Semiconductor Co., Ltd. (hereinafter referred to as “JS nepes”) is committed to providing advanced and leading wafer-level packaging and testing services and solutions... [More...]

　　The main business of JS nepes includes 8-inch and 12-inch Drive Display IC turnkey (8’’&12” Au Bump and PKG (COG & COF), Testing (CP & FT) Service), 8-inch and 12-inch CPB, solder...[More...]

　　JS nepes will provide all-round high-quality services for customers at home and abroad with superior and reliable qualit...[More...]

　　　Jiangsu nepes Semiconductor Co., Ltd. (hereinafter referred to as “JS nepes”) is committed to providing advanced and leading wafer-level packaging and testing services and solutions. Our company was established in June 2014 and is a domestic leading high-tech wafer bump packaging and testing enterprise jointly funded by Nepes corporation (a South Korean listed company, stock symbol:033640) and Huai’an stated-owned enterprises Xingsheng and Zhongsheng company. The company has a registered capital of US$95.99 million and is located at No.18, West Fazhan Avenue, Industrial Park...[More...]

Address: No.18 West Development Avenue, Huai'an Industrial Park, Huai'an City, Jiangsu Province, China.

Tel: +86 517-8990-1234 (Marketing Dept.)

E-mail: marketing_sales@jsnepes.com.cn

Website: www.jsnepes.com.cn